Etching: Circuit Board Nozzles
Wash and rinse circuit boards and wafers
Typical operating conditions for this application are listed for each nozzle
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FF
30-20 psi
0.2-1.5 bar
0.014-3.8 gpm
0.05-14 L/min
145°
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NFS, NFD
10-40 psi
0.7-3 bar
0.12-7 gpm
0.5-26.5 L/min
50°-120°
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SPN
10-40 psi
0.7-3 bar
0.5-4 gpm
1.8-15 L/min
35°-50°
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SC
10-40 psi
0.7-3 bar
0.12-4 gpm
0.5-15.1 L/min
60°-120°
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